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| Product & Service / |
Memory IC , Chips / DDR |
|
|
 |
| Features |
 |
| * |
JEDEC standard |
| * |
VDD=2.5V`'' 0.2V power supply |
| * |
Double data rate architecture. |
| * |
Cas latency- 1.5/2.0/2.5 |
| * |
Burst length- 2/4/8 |
| * |
Auto refresh and self refresh |
| * |
SSTL_2 Interface |
| * |
Package-400-mil, 66-pin Thin Small Outline Package (TSOP II)
with 0.65mm lead pitch |
|
| Features |
 |
| * |
JEDEC standard |
| * |
VDD=2.5V`'' 0.2V power supply |
| * |
Double data rate architecture. |
| * |
Cas latency- 1.5/2.0/2.5 |
| * |
Burst length- 2/4/8 |
| * |
Auto refresh and self refresh |
| * |
SSTL_2 Interface |
| * |
Package-400-mil, 66-pin Thin Small Outline Package (TSOP II)
with 0.65mm lead pitch |
|
| Features |
 |
| * |
JEDEC standard |
| * |
VDD=2.5V`'' 0.2V power supply |
| * |
Double data rate architecture. |
| * |
Cas latency- 1.5/2.0/2.5 |
| * |
Burst length- 2/4/8 |
| * |
Auto refresh and self refresh |
| * |
SSTL_2 Interface |
| * |
Package-400-mil, 66-pin Thin Small Outline Package (TSOP II)
with 0.65mm lead pitch |
|
| Part Number(Old) |
Organization |
Bank/ Interface |
Refresh |
Speed |
Package |
Power |
Production Status |
Comments |
| K4H280838D ( - ) |
16Mx8 |
4B/SSTL2 |
4K/64ms |
B3,A2,B0,A0 |
66 TSOP2 |
C, L |
Mass Production |
DDR200/266, 2.5V Vdd |
|
| Part Number(Old) |
Organization |
Bank/ Interface |
Refresh |
Speed |
Package |
Power |
Production Status |
Comments |
| K4H280838C ( - ) |
16Mx8 |
4B/SSTL2 |
4K/64ms |
A2,B0,A0 |
66 TSOP2 |
C, L |
Mass Production |
DDR200/266, 2.5V Vdd |
|
| ©2001-2008
EUDAR Technology Inc. All Rights Reserved. |
|